Light emitting device

ABSTRACT

A light emitting device comprises a package having a recess; a light emitting element mounted in the recess of the package; a light transmissive member provided above the light emitting element; a sealing resin that seals the recess of the package; and a fluorescent material contained in the sealing resin. The fluorescent material is distributed to a side of the light emitting element in a greater amount than to above the light emitting element, a side surface of the light emitting element is exposed to the sealing resin, and a portion of the light transmissive member protrudes from the sealing resin.

CROSS REFERENCE TO RELATED APPLICATION

The present application is a continuation of U.S. patent applicationSer. No. 14/318,320, filed Jun. 27, 2014, which claims priority based onJapanese Application No. 2013-137500, filed Jun. 28, 2013, thedisclosures of which are hereby incorporated by reference in theirentireties.

BACKGROUND

The present disclosure relates to a light emitting device.

Conventionally, a light emitting device with a fluorescent materialprovided in a recess of a package mounted with a light emitting elementhas been disclosed (refer to Japanese Patent Application Laid-open No.2008-103688).

SUMMARY

In one embodiment, a light emitting device comprises a package having arecess; a light emitting element mounted in the recess of the package; alight transmissive member provided above the light emitting element; asealing resin that seals the recess of the package; and a fluorescentmaterial contained in the sealing resin, wherein the fluorescentmaterial is distributed to a side of the light emitting element in agreater amount than to above the light emitting element, a side surfaceof the light emitting element is exposed to the sealing resin, and aportion of the light transmissive member protrudes from the sealingresin.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic view illustrating a light emitting deviceaccording to a first embodiment;

FIG. 2 is a schematic view illustrating a light emitting deviceaccording to a second embodiment;

FIG. 3 is a schematic view illustrating a light emitting deviceaccording to a third embodiment;

FIG. 4A is a schematic plan view of a side view type light emittingdevice to which the first, second, and third embodiments can be applied;and

FIG. 4B is a schematic cross-sectional view the light emitting devicedepicted in FIG. 4A, taken along the line A-A in FIG. 4A;

FIG. 4C is a schematic cross-sectional view of the light emitting devicedepicted in FIG. 4A, taken along the line B-B in FIG. 4A;

FIG. 5A is a schematic plan view of a top view type light emittingdevice to which the first, second, and third embodiments can be applied;and

FIG. 5B is a schematic cross-sectional view the light emitting devicedepicted in FIG. 5A, taken along the line C-C in FIG. 5A;

FIG. 5C is a schematic cross-sectional view of the light emitting devicedepicted in FIG. 5A, taken along the line D-D in FIG. 5A.

DETAILED DESCRIPTION OF THE EMBODIMENTS

[Light Emitting Device According to a First Embodiment]

FIG. 1 is a schematic view illustrating a light emitting deviceaccording to a first embodiment.

As shown in FIG. 1, the light emitting device according to the firstembodiment includes a package 10 having a recess X, a light emittingelement 20 mounted in the recess X of the package 10, a lighttransmissive member 30 provided above the light emitting element 20, asealing resin 40 that seals the recess X of the package 10, and afluorescent material 50 contained in the sealing resin 40, wherein thefluorescent material 50 is distributed to a side of the light emittingelement 20 in a greater amount than to above the light emitting element20, a side surface of the light emitting element 20 is exposed to thesealing resin 40, and a portion of the light transmissive member 30protrudes from the sealing resin 40. With the light emitting deviceaccording to the present embodiment, since the fluorescent material isdistributed to the side of the light emitting element in a greateramount than to above the light emitting element, light emitted from theside surface of the light emitting element can be efficiently used toexcite the fluorescent material.

(Package 10)

For the package 10, for example, a thermoplastic resin such as PPA(polyphthalamide), PPS (polyphenylene sulfide), liquid crystal polymer,and nylon, a thermosetting resin such as epoxy resin, silicone resin,modified epoxy resin, modified silicone resin, urethane resin, andacrylate resin as well as glass epoxy resin, ceramics, glass, or thelike may be used. As ceramics, particularly, alumina, aluminum nitride,mullite, silicon carbide, or silicon nitride is preferably used. Aluminaormullite are particularly preferable due to the high reflectance andlow cost.

The recess X included in the package 10 has a bottom surface X3 that isflat enough to allow the light emitting element 20 to be mounted and hasa shape that can be filled by the sealing resin 40. Examples of such arecess X include a recess with a trapezoidal cross section (refer toFIG. 1). With the package 10 having a recess with a trapezoidal crosssection, since light emitted from the light emitting element 20 isreflected at a side wall X2 of the recess toward an opening X1 of therecess, light extraction efficiency of the light emitting device isimproved.

(Light Emitting Element 20)

A light emitting diode may be used as the light emitting element 20. Asthe light emitting diode, for example, a light emitting diode may beused which has a growth substrate (for example, a sapphire substrate)with insulating and light-transmitting properties and a laminatedstructure including an active layer formed on the growth substrate.Moreover, the laminated structure including an active layer may beformed by various semiconductors (for example, a nitride semiconductorsuch as InN, AlN, GaN, InGaN, AlGaN, and InGaAlN, a III-V group compoundsemiconductor, and a II-VI group compound semiconductor).

While a mounting method of the light emitting element 20 is notparticularly limited, for example, the light emitting element 20 can bemounted to the recess X of the package 10 by arranging the growthsubstrate to be a mounting surface. In this case, for example, the lightemitting element 20 is electrically connected to an external electrodeof the package 10 by wire bonding. On the other hand, the light emittingelement 20 can be mounted to the recess X of the package 10 by arrangingthe side of the laminated structure including an active layer to be amounting surface. In this case, for example, the light emitting element20 is electrically connected to an external electrode of the package 10by flip-chip mounting.

The side surface of the light emitting element 20 is exposed to thesealing resin 40. Even if the fluorescent material 50 is distributed tothe side of the light emitting element 20 in a larger amount than toabove the light emitting element 20, if the light transmissive member 30coats the side surface of the light emitting element 20, light emittedfrom the side surface of the light emitting element 20 is reflected (inparticular, totally reflected) by the light transmissive member 30.Therefore, in this case, light emitted from the side surface of thelight emitting element 20 cannot be efficiently used to excite thefluorescent material 50. However, by exposing the side surface of thelight emitting element 20 to the sealing resin 40, since the sidesurface of the light emitting element 20 is not coated by the lighttransmissive member 30, light emitted from the side surface of the lightemitting element 20 can be efficiently used to excite the fluorescentmaterial 50.

(Light Transmissive Member 30)

A member having a property of transmitting light from the light emittingelement 20 is used as the light transmissive member 30. Although thedegree of light transmissions not particularly limited, for example, inaddition to the property of a member that transmits 100% of lightemitted from the light emitting element 20, a member that transmitsaround 70% or more, 80% or more, 90% or more, or 95% or more of lightemitted from the light emitting element 20 is preferably used as thelight transmissive member 30.

As the light transmissive member 30, a member having light-resistant andinsulating properties in addition to transmitting light from the lightemitting element 20 is preferably used. Examples of members having suchproperties include organics such as silicone resin, epoxy resin, urearesin, fluororesin and hybrid resins containing at least one of theseresins (for example, a silicone resin composition, a modified siliconeresin composition, an epoxy resin composition, a modified epoxy resincomposition, and an acrylic resin composition).

While the light transmissive member 30 may be provided above the lightemitting element 20, the light transmissive member 30 is preferablyprovided at a position where an amount of the fluorescent material 50that is distributed in an area sandwiched between the light transmissivemember 30 and the light emitting element 20 is small and is morepreferably provided on an upper surface of the light emitting element 20as shown in FIG. 1. Accordingly, since the amount of the fluorescentmaterial 50 distributed above the light emitting element 20 is reduced(or becomes zero), the light emitted from the upper surface of the lightemitting element 20 is less frequently reflected by the fluorescentmaterial 50 and, as a result, the light emitted from the upper surfaceof the light emitting element 20 can be more easily extracted from therecess opening X1 of the package 10.

A portion of the light transmissive member 30 protrudes from the sealingresin 40. Accordingly, an interface between the portion of the lighttransmissive member 30 that protrudes from the sealing resin 40 andoutside air is formed in the opening X1 of the recess of the package 10.As shown in FIG. 1, since the surface of the sealing resin 40 isrecessed due to sinking, a total reflection is likely to occur at aninterface between the sealing resin 40 and outside air. In comparison,since the interface between the portion of the light transmissive member30 that protrudes from the sealing resin 40 and outside air has asmaller degree of recess than the recess caused by sinking that isformed on the surface of the sealing resin 40, total reflection is lesslikely to occur than the interface between the sealing resin 40 andoutside air. Therefore, when a portion of the light transmissive member30 protrudes from the sealing resin 40, a total reflection at theopening X1 of the recess of the package 10 is reduced and lightextraction efficiency of the light emitting device is improved.Moreover, while the interface between the portion of the lighttransmissive member 30 that protrudes from the sealing resin 40 andoutside air is formed as a protruding curved surface in the exampleshown in FIG. 1, a protruding curved surface is an example of aninterface with a smaller degree of recess than the recess caused bysinking that is formed on the surface of the sealing resin 40.

A member having a surface that prevents deposition of the fluorescentmaterial 50 is preferably used as the light transmissive member 30.Accordingly, since the amount of the fluorescent material 50 distributedabove the light emitting element 20 is reduced (or becomes zero), thelight emitted from the upper surface of the light emitting element 20 isless frequently reflected by the fluorescent material 50 and, as aresult, the light emitted from the upper surface of the light emittingelement 20 can be more easily extracted from the opening X1 of therecess of the package 10.

The light transmissive member 30 preferably has a cross section with ashape of a circle (for example, an exact circle or an ellipse) having apart thereof cut away and, in the cross sectional view, a cutaway sidefaces the light emitting element 20 (refer to FIG. 1). Accordingly,since a surface of the portion of the light transmissive member 30 thatprotrudes from the sealing resin 40 is formed as a curved surface,reflection (in particular, total reflection) that may occur at aninterface between this portion and outside air can be suppressed.Therefore, light can be efficiently emitted from a surface of theportion of the light transmissive member 30 that protrudes from thesealing resin 40. In addition, by adopting such a configuration, since aportion of the light transmissive member 30 that does not protrude fromthe sealing resin 40 (a portion that exists inside the sealing resin 40)is shaped so as to include a curved surface, deposition of thefluorescent material 50 is less likely to occur on the surface of thelight transmissive member 30 in the sealing resin 40. As a result, thefluorescent material 50 is more likely to be deposited to the side ofthe light emitting element 20.

For example, the light transmissive member 30 can be provided by pottinga thermosetting resin on an upper surface of the light emitting element20 and hardening the thermosetting resin. Accordingly, due to surfacetension of the thermosetting resin, a surface of the portion of thelight transmissive member 30 that does not protrude from the sealingresin 40 (a portion that exists inside the sealing resin 40) acquires ashape that prevents deposition of the fluorescent material 50.

On the other hand, in the case of flip-chip mounting, since an uppersurface of the light emitting element 20 is a flat surface, the lighttransmissive member 30 may be provided by bonding the light transmissivemember 30 to the upper surface of the light emitting element 20. Forexample, in the case of using a light emitting diode having positive andnegative electrodes on a same surface, the light transmissive member 30can be easily bonded to the upper surface of the light emitting element20.

A microstructure such as recesses and projections or a microlens ispreferably provided on the surface of the light transmissive member 30.Accordingly, since reflection at an interface between the sealing resin40 and the portion of the light transmissive member 30 that does notprotrude from the sealing resin 40 (a portion that exists inside thesealing resin 40) as well as an interface between the light transmissivemember 30 and outside air is reduced, light extraction efficiency of thelight emitting device increases. Moreover, since the sealing resin 40 isnot hardened and readily spreads to its surroundings during a formingstep thereof, even if recesses and projections are formed on the lighttransmissive member 30, the fluorescent material 50 does not accumulate(or only a small amount accumulates) on the recesses and projections.

(Sealing Resin 40)

Materials similar to those described above with respect to the lighttransmissive member 30 may be used as the sealing resin 40.

For example, the sealing resin 40 is provided by potting a resin in therecess X of the package 10 and hardening the resin.

(Fluorescent Material 50)

The fluorescent material 50 exists to the side of the light emittingelement 20 in a larger amount than to above the light emitting element20. Accordingly, since the amount of the fluorescent material 50distributed above the light emitting element 20 becomes smaller than theamount of the fluorescent material 50 distributed to the side of thelight emitting element 20 (or becomes zero), the light emitted from theupper surface of the light emitting element 20 is less frequentlyreflected by the fluorescent material 50 and, as a result, the lightemitted from the upper surface of the light emitting element 20 can bemore easily extracted from the opening X1 of the recess of the package10. In addition, since the amount of the fluorescent material 50distributed to the side of the light emitting element 20 becomes largerthan the amount of the fluorescent material 50 distributed above thelight emitting element 20, the light emitted from the side surface ofthe light emitting element 20 can be efficiently used to excite thefluorescent material 50. Moreover, when the light emitted from the sidesurface of the light emitting element 20 is efficiently used to excitethe fluorescent material 50, since it is more difficult for the lightemitted from the side surface of the light emitting element 20 to reachthe side wall X2 of the recess of the package 10, the light emitted fromthe side surface of the light emitting element 20 can be prevented frompassing through the side wall X2 of the recess of the package 10 andexiting outside the package 10.

Examples of the distribution described above include a mode such as thatshown in FIG. 1 where the fluorescent material 50 is deposited on thebottom surface X3 of the recess of the package 10. Such a mode can beformed by, for example, depositing the fluorescent material 50 in therecess X of the package 10 before hardening the sealing resin 40.

As the fluorescent material 50, a fluorescent material that is excitedby light emitted from the light emitting element 20 and emits light maybe used. While a fluorescent material that emits light with a shorterwavelength than the light emitted from the light emitting element 20 maybe used, a fluorescent material that emits light with a longerwavelength is more preferable. Accordingly, since the fluorescentmaterial can efficiently emit light, light extraction efficiency of thelight emitting device increases.

Examples of materials that may be used as a fluorescent material thatemits light with a longer wavelength than the light emitted from thelight emitting element 20 include a nitride-based fluorescent phosphoror an oxynitride-based fluorescent phosphor that is mainly activated bya lanthanoid element such as Eu and Ce and, more specifically, an α or βsialon-type fluorescent phosphor that is activated by Eu, variousalkaline-earth metal silicate nitride fluorescent bodies, analkaline-earth metal halogen apatite fluorescent phosphor, analkaline-earth halosilicate fluorescent phosphor, an alkaline-earthmetal silicate fluorescent phosphor, an alkaline-earth metal halogenborate fluorescent phosphor, an alkaline-earth metal aluminatefluorescent phosphor, an alkaline-earth metal silicate, analkaline-earth metal sulfide, an alkaline-earth metal thiogallate, analkaline-earth metal silicon nitride, and germanate that are mainlyactivated by a lanthanoid element such as Eu or a transition metalelement such as Mn, a rare-earth aluminate and a rare-earth silicatethat are mainly activated by a lanthanoid element such as Ce, andorganics, organic complexes, and the like that are mainly activated by alanthanoid element such as Eu. Obviously, fluorescent materials whichproduce similar performance and effects to the fluorescent materialsdescribed above may be used instead. Moreover, when a nitridesemiconductor-based light emitting element is used as the light emittingelement 20, for example, a fluorescent material such as a YAGfluorescent material (yellow fluorescent material) or a LAG fluorescentmaterial (yellow fluorescent material) is preferably used.

When the fluorescent material 50 is deposited lower than the activelayer of the light emitting element 20 to the side of the light emittingelement 20, since light emitted from a side surface in an area below theactive layer of the light emitting element 20 (for example, the growthsubstrate) enters the fluorescent material 50 immediately after beingemitted, the light emitted from a side surface in an area below theactive layer of the light emitting element 20 (for example, the growthsubstrate) can be efficiently used to excite the fluorescent material50.

On the other hand, when the fluorescent material 50 is deposited higherthan the active layer of the light emitting element 20 to the side ofthe light emitting element 20, since light emitted from a side surfaceof the active layer of the light emitting element 20 enters thefluorescent material 50 immediately after being emitted in addition tolight emitted from a side surface in an area below the active layer ofthe light emitting element 20 (for example, the growth substrate), boththe light emitted from a side surface in an area below the active layerof the light emitting element 20 (for example, the growth substrate) andthe light emitted from a side surface of the active layer of the lightemitting element 20 can be efficiently used to excite the fluorescentmaterial 50.

[Light Emitting Device According to a Second Embodiment]

FIG. 2 is a schematic view illustrating a light emitting deviceaccording to a second embodiment.

As shown in FIG. 2, the light emitting device according to the secondembodiment differs from the light emitting device according to the firstembodiment, because in the first embodiment, the interface between theportion of the light transmissive member 30 that protrudes from thesealing resin 40 and outside air is a protruding curved surface, whilein the second embodiment, the interface is a flat surface.

Even according to the second embodiment, since total reflection at theopening X1 of the recess of the package 10 decreases, light extractionefficiency of the light emitting device is improved. Moreover, a flatsurface is an example of an interface with a smaller degree of recessthan the recess caused by sinking that is formed on the surface of thesealing resin 40.

[Light Emitting Device According to a Third Embodiment]

FIG. 3 is a schematic view illustrating a light emitting deviceaccording to a third embodiment.

As shown in FIG. 3, the light emitting device according to the thirdembodiment differs from the light emitting device according to the firstembodiment in that the fluorescent material 50 is not deposited on thebottom surface X3 of the recess of the package 10.

Even with the light emitting device according to the third embodiment,in a similar manner to the light emitting device according to the firstembodiment, the fluorescent material 50 is distributed to the side ofthe light emitting element 20 in a larger amount than to above the lightemitting element 20, a side surface of the light emitting element 20 isexposed to the sealing resin 40, and a portion of the light transmissivemember 30 protrudes from the sealing resin 40.

As described above, in the light emitting devices according to the firstto third embodiments, since the fluorescent material 50 is distributedto the side of the light emitting element 20 in a larger amount than toabove the light emitting element 20 and a side surface of the lightemitting element 20 is exposed to the sealing resin 40, light emittedfrom the upper surface of the light emitting element 20 is more easilyextracted from the opening X1 of the recess of the package 10 and lightemitted from the side surface of the light emitting element 20 can beefficiently used to excite the fluorescent material 50. In particular,with the light emitting devices according to the first to thirdembodiments, since a portion of the light transmissive member 30protrudes from the sealing resin 40, a total reflection at the openingX1 of the recess of the package 10 is reduced and light extractionefficiency of the light emitting device is improved.

Moreover, the first to third embodiments can be particularly preferablyapplied to a light emitting device in which an electrode such as a padelectrode or an ITO is provided on the upper surface of the lightemitting element 20. According to the first to third embodiments, sincethe light emitted from the upper surface of the light emitting element20 is less frequently reflected by the fluorescent material 50, lightreflected by the fluorescent material 50 above the light emittingelement 20 is prevented from being absorbed by an electrode such as apad electrode or an ITO and light extraction efficiency of the lightemitting devices can be improved.

In addition, the first to third embodiments can be particularlypreferably applied to a light emitting device in which the side wall X2of the recess of the package 10 is thin enough to allow light to passthrough the side wall X2 of the recess even when a reflective member isprovided (for example, a light emitting device in which the thickness ofside wall X2 of the recess of the package 10 is around 0.1 mm).According to the first to third embodiments, since the light emittedfrom the side surface of the light emitting element 20 can be preventedfrom passing through the side wall X2 of the recess of the package 10and exiting outside the package 10, light extraction efficiency can beimproved in a light emitting device in which the side wall X2 of therecess of the package 10 is thin.

Furthermore, the first to third embodiments can also be preferablyapplied to a light emitting element 20 that uses ceramics for thepackage 10. While ceramics are inorganic materials that hardlydeteriorate and are highly reliable, ceramics have lower reflectancethan resin materials containing light reflecting members and are morelikely to transmit light from the light emitting element 20. However,according to the first to third embodiments, since the light emittedfrom the side surface of the light emitting element 20 can be preventedfrom passing through the side wall X2 of the recess of the package 10and exiting outside the package 10, light extraction efficiency can beimproved in a light emitting device that uses ceramics for the package10.

FIG. 4 is a schematic view of a side view type light emitting device towhich the first to third embodiments can be applied, wherein FIG. 4A isa schematic plan view, FIG. 4B is a schematic cross-sectional view takenalong the line A-A in FIG. 4A, and FIG. 4C is a schematiccross-sectional view taken along the line B-B in FIG. 4A.

The embodiments can also be applied to a side view type light emittingdevice such as that shown in FIG. 4. In the side view type of lightemitting devices shown in FIG. 4, the light transmissive member 30 isprovided on the upper surface of the light emitting element 20 bypotting after the light emitting element 20 is electrically connected toan external electrode of the package 10 by wire bonding using the wire60. In addition, the wire 60 is projected from the light transmissivemember 30.

FIG. 5 is a schematic view of a top view type light emitting device towhich the first to third embodiments can be applied, wherein FIG. 5A isa schematic plan view, FIG. 5B is a schematic cross-sectional view takenalong the line C-C in FIG. 5A, and FIG. 5C is a schematiccross-sectional view taken along the line D-D in FIG. 5A.

The embodiments can also be applied to a top view type light emittingdevice such as that shown in FIG. 5. The top view type of light emittingdevices shown in FIG. 5 includes a plurality of light emitting elements21 and 22. The light emitting elements 21 and 22 are respectivelyprovided with light transmissive members 31 and 32. The light emittingelements 21 and 22 are connected in series using the wire 60, and bothends of the wire 60 connecting the light emitting elements 21 and 22 arerespectively coated by the light transmissive members 31 and 32. Thefluorescent material 50 is distributed not only between the lightemitting elements 21 and 22 and the side wall X2 of the package 10 butalso between the light emitting element 21 and the light emittingelement 22.

While embodiments have been described above, the description merelyrepresents examples and is not intended to limit the construction asdefined in the scope of the claims in any way whatsoever.

What is claimed is:
 1. A method for manufacturing a light emittingdevice comprising: mounting a light emitting element in a recess of apackage; disposing a light transmissive member above the light emittingelement; and depositing a sealing resin so as to seal the recess of thepackage, the sealing resin containing a fluorescent material; whereinthe fluorescent material is distributed to a side of the light emittingelement in a greater amount than to above the light emitting element,wherein a side surface of the light emitting element is exposed to thesealing resin, and wherein a portion of the light transmissive memberprotrudes from the sealing resin.
 2. The method according to claim 1,wherein the light transmissive member has a cross section with a shapeof a circle having a cutaway side that faces the light emitting elementin a cross-sectional view.
 3. The method according to claim 1, whereinthe sealing resin is deposited such that the fluorescent material isdeposited on a bottom surface of the recess of the package.
 4. Themethod according to claim 3, wherein the fluorescent material isdeposited at a location lower than an active layer of the light emittingelement.
 5. The method according to claim 1, further comprising: priorto disposing the light transmissive member on the light emittingelement, connecting the light emitting element and an external electrodeof the package via a wire.
 6. The method according to claim 1, whereinthe light emitting element is mounted by flip-chip mounting.
 7. Themethod according to claim 1, wherein the light transmissive member isbonded to an upper surface of the light emitting element.
 8. The methodaccording to claim 1, wherein the light transmissive member is disposedby potting a thermosetting resin on an upper surface of the lightemitting element and hardening the thermosetting resin.
 9. A method formanufacturing a light emitting device comprising: mounting a lightemitting element in a recess of a package; disposing a lighttransmissive member on an upper surface of the light emitting element;and depositing a light transmissive sealing resin so as to seal therecess of the package, wherein a protruding surface attributable to thelight transmissive member is formed at an interface in contact withoutside air, wherein a portion of a surface of the sealing resin aroundthe protruding surface is sunken relative to an outermost periphery ofthe sealing resin, and wherein a portion of the light transmissivemember is positioned higher than the sunken portion of the sealingresin.
 10. The method according to claim 9, wherein the protrudingsurface protrudes beyond an opening surface of the recess of thepackage.
 11. The method according to claim 9, wherein the sealing resincontains a fluorescent material.
 12. The method according to claim 9,wherein the light transmissive member has a cross section with a shapeof a circle having a cutaway side that faces the light emitting elementin a cross-sectional view.
 13. The method according to claim 11, whereinthe sealing resin is deposited such that the fluorescent material isdeposited on a bottom surface of the recess of the package.
 14. Themethod according to claim 9, wherein the light transmissive member has asurface that inhibits deposition of the fluorescent material.
 15. Themethod according to claim 9 further comprising: prior to providing thelight transmissive member on the light emitting element, connecting thelight emitting element and an external electrode of the package via awire.
 16. The method according to claim 9, wherein the light emittingelement is mounted by flip-chip mounting.
 17. The method according toclaim 9, wherein the light transmissive member is bonded to an uppersurface of the light emitting element.
 18. The method according to claim9, wherein the light transmissive member is disposed by potting athermosetting resin on an upper surface of the light emitting elementand hardening the thermosetting resin.
 19. A method for manufacturing alight emitting device comprising: mounting a light emitting element in arecess of a package; disposing a light transmissive member on an uppersurface of the light emitting element; and depositing a lighttransmissive sealing resin so as to seal the recess of the package,wherein, in a cross-section of the light emitting device, an interfacein contact with outside air has two inflection points at positions lowerthan a height of an outermost periphery of the sealing resin, wherein aninterface connecting the two inflection points protrudes upward, andwherein a portion of the light transmissive member is positioned higherthan the two inflection points.